Analysis of the Effect of EBG on the Mutual Coupling for a two-PIFA Assembly.

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Publication date
08/11/2010
Author
Abidin, Z.Z.
Abd-Alhameed, Raed A.
McEwan, R.A.
Child, Mark B.
Keyword
EGB
Two-element PIFA assembly
Antennas
Mutual Coupling
Rights
© 2010 IEEE. Reprinted, with permission: Abidin, Z. Z., Abd-Alhameed, R. A., McEwan, N. J. and Child, M. B. (2010). Analysis of the Effect of EBG on the Mutual Coupling for a two-PIFA Assembly. In: Loughborough Antennas & Propagation Conference (LAPC10), 8-9 November 2010, Loughborough, UK. IEEE. ISBN: 978-1-4244-7306-9/10. pp. 473-476. This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of the University of Bradford¿s products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to pubs-permissions@ieee.org. By choosing to view this document, you agree to all provisions of the copyright laws protecting it.
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Abstract
Size constraints and mutual coupling on the performance of a two-element PIFA assembly are investigated for a design frequency of 2.4 GHz. A benchmark antenna assembly, employing a normal metallic ground plane is compared with an EBG modified ground plane. The height of the antenna elements over the EBG is optimised, and an isolation factor of 9.12 dB is achieved for a gap of 2.5 mm. Prototype structures have been constructed and measured for both cases.
URI
http://hdl.handle.net/10454/4787
Version
Accepted Manuscript
Citation
Abidin, Z. Z., Abd-Alhameed, R. A., McEwan, N. J. and Child, M. B. (2010). Analysis of the Effect of EBG on the Mutual Coupling for a two-PIFA Assembly. In: Loughborough Antennas & Propagation Conference (LAPC10), 8-9 November 2010, Loughborough, UK. IEEE. ISBN: 978-1-4244-7306-9/10. pp. 473-476.
Link to publisher’s version
http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=5666200
Type
Conference paper
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