High-Performance 50μm Silicon-Based On-Chip Antenna with High Port-To-Port Isolation Implemented by Metamaterial and SIW Concepts for THz Integrated Systems
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2019-09-16Rights
© 2020 IEEE. Reproduced in accordance with the publisher's self-archiving policy.Peer-Reviewed
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A novel 50μm Silicon-based on-chip antenna is presented that combines metamaterial (MTM) and substrate integrated waveguide (SIW) technologies for integration in THz circuits operating from 0.28 to 0.30 THz. The antenna structure comprises a square patch antenna implemented on a Silicon substrate with a ground-plane. Embedded diagonally in the patch are two T-shaped slots and the edges of the patch is short-circuited to the ground-plane with metal vias, which convert the structure into a substrate integrated waveguide. This structure reduces loss resulting from surface waves and Silicon dielectric substrate. The modes in the structure can be excited through two coaxial ports connected to the patch from the underside of the Silicon substrate. The proposed antenna structure is essentially transformed to exhibit metamaterial properties by realizing two T-shaped slots, which enlarges the effective aperture area of the miniature antenna and significantly enhances its impedance bandwidth and radiation characteristics between 0.28 THz to 0.3 THz. It has an average gain and efficiency of 4.5dBi and 65%, respectively. In addition, it is a self-isolated structure with high isolation of better than 30dB between the two ports. The on-chip antenna has dimensions of 800×800×60 μm3.Version
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Alibakhshikenari M, Virdee BS, See CH et al (2019) High-Performance 50µm Silicon-Based On-Chip Antenna with High Port-to-Port Isolation Implemented by Metamaterial and SIW Concepts for THz Integrated Systems. Thirteenth International Congress on Artificial Materials for Novel Wave Phenomena (Metamaterials), Rome, Italy, 2019. pp X-023-X-025. IEEE.Link to Version of Record
https://doi.org/10.1109/MetaMaterials.2019.8900874Type
Conference paperae974a485f413a2113503eed53cd6c53
https://doi.org/10.1109/MetaMaterials.2019.8900874