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    High performance on-chip array antenna based on metasurface feeding structure for terahertz integrated circuits

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    Accepted manuscript (117.9Kb)
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    Publication date
    2019-09-01
    Author
    Alibakhshikenari, M.
    Virdee, B.S.
    See, C.H.
    Abd-Alhameed, Raed A.
    Limiti, E.
    Keyword
    Array antenna
    Metasurface
    Terahertz IC
    Antenna arrays
    System-on-chip
    Silicon
    Dipole antennas
    Antenna feeds
    Slot antennas
    Rights
    © 2019 IEEE. Reproduced in accordance with the publisher's self-archiving policy.
    Peer-Reviewed
    Yes
    
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    Abstract
    In this letter a novel on-chip array antenna is investigated which is based on CMOS 20μm Silicon technology for operation over 0.6-0.65 THz. The proposed array structure is constructed on three layers composed of Silicon-Ground-Silicon layers. Two antennas are implemented on the top layer, where each antenna is constituted from three sub-antennas. The sub-antennas are constructed from interconnected dual-rings. Also, the sub-antennas are interconnected to each other. This approach enhances the aperture of the array. Surface waves and substrate losses in the structure are suppressed with metallic via-holes implemented between the radiation elements. To excite the structure, a novel feeding mechanism is used comprising open-circuited microstrip lines that couple electromagnetic energy from the bottom layer to the antennas on the top-layer through metasurface slot-lines in the middle ground-plane layer. The results show the proposed on-chip antenna array has an average radiation gain, efficiency, and isolation of 7.62 dBi, 32.67%, and -30 dB, respectively.
    URI
    http://hdl.handle.net/10454/18118
    Version
    Accepted manuscript
    Citation
    Alibakhshikenari M, Virdee BS, See CH et al (2019) High performance on-chip array antenna based on metasurface feeding structure for terahertz integrated circuits. 44th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz). 1-6 September 2019, Paris, France.
    Link to publisher’s version
    https://doi.org/10.1109/IRMMW-THz.2019.8874127
    Type
    Conference paper
    Collections
    Engineering and Informatics Publications

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