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dc.contributor.authorAlibakhshikenari, M.
dc.contributor.authorVirdee, B.S.
dc.contributor.authorSee, C.H.
dc.contributor.authorAbd-Alhameed, Raed A.
dc.contributor.authorFalcone, F.
dc.contributor.authorLimiti, E.
dc.date.accessioned2020-10-14T09:41:19Z
dc.date.available2020-10-14T09:41:19Z
dc.date.issued2019-12-10
dc.identifier.citationAlibakhshikenari M, Virdee BS, See CH et al (2019) Overcome the Limitations of Performance Parameters of On-Chip Antennas Based on Metasurface and Coupled Feeding Approaches for Applications in System-on-Chip for THz Integrated-Circuits. IEEE Asia-Pacific Microwave Conference (APMC). 10-13 December 2019. Singapore. 246-248.en_US
dc.identifier.urihttp://hdl.handle.net/10454/18114
dc.descriptionYesen_US
dc.description.abstractThis paper proposes a new solution to improve the performance parameters of on-chip antenna designs on standard CMOS silicon (Si.) technology. The proposed method is based on applying the metasurface technique and exciting the radiating elements through coupled feed mechanism. The on-chip antenna is constructed from three layers comprising Si.-GND-Si. layers, so that the ground (GND) plane is sandwiched between two Si. layers. The silicon and ground-plane layers have thicknesses of 20μm and 5μm, respectively. The 3×3 array consisting of the asterisk-shaped radiating elements has implemented on the top silicon layer by applying the metasurface approach. Three slot lines in the ground-plane are modelled and located directly under the radiating elements. The radiating elements are excited through the slot-lines using an open-circuited microstrip-line constructed on the bottom silicon layer. The proposed method to excite the structure is based on the coupled feeding mechanism. In addition, by the proposed feeding method the on-chip antenna configuration suppresses the substrate losses and surface-waves. The antenna exhibits a large impedance bandwidth of 60GHz from 0.5THz to 0.56THz with an average radiation gain and efficiency of 4.58dBi and 25.37%, respectively. The proposed structure has compact dimensions of 200×200×45μm3. The results shows that, the proposed technique is therefore suitable for on-chip antennas for applications in system-on-chip for terahertz (THz) integrated circuits.en_US
dc.description.sponsorshipInnovation programme under grant agreement H2020-MSCA-ITN-2016 SECRET-722424; UK Engineering and Physical Sciences Research Council (EPSRC) under grant EP/E0/22936/1.en_US
dc.language.isoenen_US
dc.relation.isreferencedbyhttps://doi.org/10.1109/APMC46564.2019.9038524en_US
dc.rights(c) 2019 IEEE. Full-text reproduced in accordance with the publisher's self-archiving policy.en_US
dc.subjectOn-chip antennasen_US
dc.subjectMetasurfaceen_US
dc.subjectTerahertz systems-on-chip applicationsen_US
dc.titleOvercome the Limitations of Performance Parameters of On-Chip Antennas Based on Metasurface and Coupled Feeding Approaches for Applications in System-on-Chip for THz Integrated-Circuitsen_US
dc.status.refereedYesen_US
dc.typeConference paperen_US
dc.date.EndofEmbargo2020-12-11
dc.type.versionAccepted manuscripten_US
dc.description.publicnotesThe full-text of this paper will be released for public view at the end of the publisher embargo on 11 Dec 2020.en_US
refterms.dateFOA2020-10-14T09:41:49Z


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