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dc.contributor.authorAlibakhshikenari, M.
dc.contributor.authorVirdee, B.S.
dc.contributor.authorSee, C.H.
dc.contributor.authorAbd-Alhameed, Raed A.
dc.contributor.authorFalcone, F.
dc.contributor.authorLimiti, E.
dc.date.accessioned2020-08-05T14:00:28Z
dc.date.accessioned2020-08-19T15:14:19Z
dc.date.available2020-08-05T14:00:28Z
dc.date.available2020-08-19T15:14:19Z
dc.date.issued2020-03
dc.identifier.citationAlibakshsikenari M, Virdee BS, See CH et al (2020) High-gain metasurface in polyimide on-chip antenna based on CRLH-TL for sub-terahertz integrated circuits. Scientific Reports, 10: 4298.en_US
dc.identifier.urihttp://hdl.handle.net/10454/17985
dc.descriptionYesen_US
dc.description.abstractThis paper presents a novel on-chip antenna using standard CMOS-technology based on metasurface implemented on two-layers polyimide substrates with a thickness of 500 μm. The aluminium ground-plane with thickness of 3 μm is sandwiched between the two-layers. Concentric dielectric-rings are etched in the ground-plane under the radiation patches implemented on the top-layer. The radiation patches comprise concentric metal-rings that are arranged in a 3 × 3 matrix. The antennas are excited by coupling electromagnetic energy through the gaps of the concentric dielectric-rings in the ground-plane using a microstrip feedline created on the bottom polyimide-layer. The open-ended feedline is split in three-branches that are aligned under the radiation elements to couple the maximum energy. In this structure, the concentric metal-rings essentially act as series left-handed capacitances CL that extend the effective aperture area of the antenna without affecting its dimensions, and the concentric dielectric rings etched in the ground-plane act as shunt left-handed inductors LL, which suppress the surface-waves and reduce the substrates losses that leads to improved bandwidth and radiation properties. The overall structure behaves like a metasurface that is shown to exhibit a very large bandwidth of 0.350–0.385 THz with an average radiation gain and efficiency of 8.15dBi and 65.71%, respectively. It has dimensions of 6 × 6 × 1 mm3 that makes it suitable for on-chip implementation.en_US
dc.description.sponsorshipThis work is partially supported by RTI2018-095499-B-C31, Funded by Ministerio de Ciencia, Innovación y Universidades, Gobierno de España (MCIU/AEI/FEDER,UE), and innovation programme under grant agreement H2020-MSCA-ITN-2016 SECRET-722424 and the fnancial support from the UK Engineering and Physical Sciences Research Council (EPSRC) under grant EP/E022936/1.en_US
dc.language.isoenen_US
dc.relation.isreferencedbyhttps://doi.org/10.1038/s41598-020-61099-8en_US
dc.rights© The Author(s) 2020. Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. Te images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/.en_US
dc.subjectOn-chip antennaen_US
dc.subjectTerahertz (THz)en_US
dc.subjectMetasurfaceen_US
dc.subjectMetamaterialsen_US
dc.subjectPolyimide substrateen_US
dc.subjectElectromagnetic couplingen_US
dc.subjectComposite right/left handed transmission line (CRLH-TL)en_US
dc.subjectWide bandwidthen_US
dc.subjectSystem-on-chip (SoC)en_US
dc.subjectArtificial magnetic conductor (AMC)en_US
dc.subjectResearch Development Fund Publication Prize Award
dc.titleHigh-gain metasurface in polyimide on-chip antenna based on CRLH-TL for sub-terahertz integrated circuitsen_US
dc.status.refereedYesen_US
dc.date.Accepted2020-02-20
dc.date.application2020-03-09
dc.typeArticleen_US
dc.type.versionPublished versionen_US
dc.description.publicnotesResearch Development Fund Publication Prize Award winner, March 2020
dc.date.updated2020-08-05T13:00:32Z
refterms.dateFOA2020-08-19T15:15:13Z


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