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dc.contributor.authorOguntala, George A.*
dc.contributor.authorSobamowo, G.*
dc.contributor.authorAbd-Alhameed, Raed A.*
dc.contributor.authorNoras, James M.*
dc.date.accessioned2019-03-29T14:29:28Z
dc.date.available2019-03-29T14:29:28Z
dc.date.issued2019-07
dc.identifier.citationOguntala GA, Sobamowo GM, Abd-Alhameed R et al (2019) Numerical study of performance of porous fin heat sink of functionally graded material for improved thermal management of consumer electronics. IEEE Transactions on Components, Packaging and Manufacturing Technology. 9(7): 1271-1283.en_US
dc.identifier.urihttp://hdl.handle.net/10454/16934
dc.descriptionYesen_US
dc.description.abstractThe ever-increasing demand for high performance electronic and computer systems has unequivocally called for increased microprocessor performance. However, increasing microprocessor performance requires increasing the power and on-chip power density of the microprocessor, both of which are associated with increased heat dissipation. In recent times, thermal management of electronic systems has gained intense research attention due to increased miniaturization trend in the electronics industry. In the paper, we present a numerical study on the performance of a convective-radiative porous heat sink with functionally graded material for improved cooling of various consumer electronics. For the theoretical investigation, the thermal property of the functionally graded material is assumed as a linear and power-law function. We solved the developed thermal models using the Chebyshev spectral collocation method. The effects of inhomogeneity index of FGM, convective and radiative parameters on the thermal behaviour of the porous heat sink are investigated. The present study shows that increase in the inhomogeneity index of FGM, convective and radiative parameter improves the thermal efficiency of the porous fin heat sink. Moreover, for all values of Nc and Rd, the temperature gradient along the fin of FGM is negligible compared to HM fin in both linear and power-law functions. For comparison, the thermal predictions made in the present study using Chebyshev spectral collocation method agrees excellently with the established results of Runge-Kutta with shooting and homotopy analytical method.en_US
dc.description.sponsorshipSupported in part from PhD sponsorship of the first author by the Tertiary Education Trust Fund of the Federal Government of Nigeria.en_US
dc.language.isoenen_US
dc.relation.isreferencedbyhttps://doi.org/10.1109/TCPMT.2019.2907150en_US
dc.rights© 2019 IEEE. Reproduced in accordance with the publisher's self-archiving policy.en_US
dc.subjectConsumer electronicsen_US
dc.subjectFunctionally graded materialen_US
dc.subjectHeatsinken_US
dc.subjectPorous finen_US
dc.subjectThermal managementen_US
dc.subjectHeat transferen_US
dc.subjectHeating systemsen_US
dc.subjectFluidsen_US
dc.subjectPackagingen_US
dc.subjectMicroprocessorsen_US
dc.titleNumerical study of performance of porous fin heat sink of functionally graded material for improved thermal management of consumer electronicsen_US
dc.status.refereedYesen_US
dc.date.Accepted2019-03-17
dc.date.application2019-03-27
dc.typeArticleen_US
dc.type.versionAccepted manuscripten_US
refterms.dateFOA2019-03-29T14:29:28Z


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