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dc.contributor.authorOguntala, G.A.*
dc.contributor.authorSobamowo, G.*
dc.contributor.authorEya, N.*
dc.contributor.authorAbd-Alhameed, Raed A.*
dc.date.accessioned2018-11-01T11:59:20Z
dc.date.available2018-11-01T11:59:20Z
dc.date.issued2019-02
dc.identifier.citationOguntala GA, Sobamowo G, Eya NN et al (2019) Investigation of Simultaneous Effects of Surface Roughness, Porosity, and Magnetic Field of Rough Porous Microfin Under a Convective-Radiative Heat Transfer for Improved Microprocessor Cooling of Consumer Electronics. IEEE Transactions on Components, Packaging and Manufacturing Technology. 9(2): 235-246.en_US
dc.identifier.urihttp://hdl.handle.net/10454/16639
dc.descriptionYesen_US
dc.description.abstractThe ever-increasing demand for high-processing electronic systems has unequivocally called for improved microprocessor performance. However, increasing microprocessor performance requires increasing power and on-chip power density, both of which are associated with increased heat dissipation. Electronic cooling using fins have been identified as a reliable cooling approach. However, an investigation into the thermal behaviour of fin would help in the design of miniaturized, effective heatsinks for reliable microprocessor cooling. The aim of this paper is to investigates the simultaneous effects of surface roughness, porosity and magnetic field on the performance of a porous micro-fin under a convective-radiative heat transfer mechanism. The developed thermal model considers variable thermal properties according to linear, exponential and power laws, and are solved using Chebychev spectral collocation method. Parametric studies are carried using the numerical solutions to establish the influences of porosity, surface roughness, and magnetic field on the microfin thermal behaviour. Following the results of the simulation, it is established that the thermal efficiency of the micro-fin is significantly affected by the porosity, magnetic field, geometric ratio, nonlinear thermal conductivity parameter, thermogeometric parameter and the surface roughness of the micro-fin. However, the performance of the micro-fin decreases when it operates only in a convective environment. In addition, we establish that the fin efficiency ratio which is the ratio of the efficiency of the rough fin to the efficiency of the smooth fin is found to be greater than unity when the rough and smooth fins of equal geometrical, physical, thermal and material properties are subjected to the same operating condition. The investigation establishes that improved thermal management of electronic systems would be achieved using rough surface fins with porosity under the influences of the magnetic field.en_US
dc.description.sponsorshipSupported in part by the Tertiary Education Trust Fund of Federal Government of Nigeria, and the European Union’s Horizon 2020 research and innovation programme under grant agreement H2020-MSCA-ITN- 2016SECRET-722424.en_US
dc.language.isoenen_US
dc.relation.isreferencedbyhttps://doi.org/10.1109/TCPMT.2018.2878737en_US
dc.rights© 2019 IEEE. Reproduced in accordance with the publisher's self-archiving policy. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.en_US
dc.subjectElectronic coolingen_US
dc.subjectThermal managementen_US
dc.subjectHeatsinken_US
dc.subjectMicro-finen_US
dc.subjectSurface roughnessen_US
dc.subjectMicroprocessor coolingen_US
dc.titleInvestigation of Simultaneous Effects of Surface Roughness, Porosity, and Magnetic Field of Rough Porous Microfin Under a Convective-Radiative Heat Transfer for Improved Microprocessor Cooling of Consumer Electronicsen_US
dc.status.refereedYesen_US
dc.date.Accepted2018-10-13
dc.date.application2018-10-30
dc.typeArticleen_US
dc.type.versionAccepted Manuscripten_US
refterms.dateFOA2018-11-01T11:59:20Z


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