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    Effect of interlayer configurations on joint formation in TLP bonding of Ti-6Al-4V to Mg-AZ31

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    Publication date
    2014
    Author
    Atieh, A.M.
    Khan, Tahir I.
    Keyword
    TLP bonding; Nickel; Ti-6AI-4-V; Mg-AZ31; Eutectic
    Rights
    (c) 2014 The Authors. This is an Open Access article distributed under the Creative Commons CC-BY license.
    Peer-Reviewed
    Yes
    
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    Abstract
    In this research work, the transient liquid phase (TLP) bonding process was utilized to fabricate joints using thin (20μm) nickel and copper foils placed between two bonding surfaces to help facilitate joint formation. Two joint configurations were investigated, first, Ti- 6Al-4V/CuNi/Mg-AZ31 and second, Ti-6Al-4V/NiCu/Mg-AZ31. The effect of bonding time on microstructural developments across the joint and the changes in mechanical properties were studied as a function of bonding temperature and pressure. The bonded specimens were examined by metallographic analysis, scanning electron microscopy (SEM), and X-ray diffraction (XRD). In both cases, intermetallic phase of CuMg2 and Mg3AlNi2 was observed inside the joint region. The results show that joint shear strengths for the Ti-6Al-4V/CuNi/Mg- AZ31 setup produce joints with shear strength of 57 MPa compared to 27MPa for joints made using the Ti-6Al-4V/NiCu/Mg-AZ31 layer arrangement.
    URI
    http://hdl.handle.net/10454/12047
    Version
    Published version
    Citation
    Atieh AM and Khan TI (2014) Effect of interlayer configurations on joint formation in TLP bonding of Ti-6Al-4V to Mg-AZ31. IOP Conference Series: Materials Science and Engineering. 60, conference 1.
    Link to publisher’s version
    https://doi.org/10.1088/1757-899X/60/1/012036
    Type
    Article
    Collections
    Engineering and Informatics Publications

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