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dc.contributor.authorAtieh, A.M.*
dc.contributor.authorKhan, Tahir I.*
dc.date.accessioned2017-03-13T17:03:27Z
dc.date.available2017-03-13T17:03:27Z
dc.date.issued2014-07-30
dc.identifier.citationAtieh AM and Khan TI (2014) Application of Ni and Cu nanoparticles in transient liquid phase (TLP) bonding of Ti-6Al-4V and Mg-AZ31 alloys. Journal of Materials Science. 49(22): 7648-7658.en_US
dc.identifier.urihttp://hdl.handle.net/10454/11603
dc.descriptionNoen_US
dc.description.abstractThe transient liquid phase (TLP) bonding of Ti-6Al-4V alloy to a Mg-AZ31 alloy was performed using an electrodeposited Ni coating containing a dispersion of Ni and Cu nanoparticles. Bond formation was attributed to two mechanisms; first, solid-state diffusion of Ni and Mg, followed by liquid eutectic formation at the Mg-AZ31 interface. Second, the solid-state diffusion of Ni and Ti at the Ti-6Al-4V interface resulted in a metallurgical joint. The joint interface was characterized by scanning electron microscopy, energy dispersive X-ray spectroscopy, and X-ray diffraction analysis. Microhardness and shear strength tests were used to investigate the mechanical properties of the bonds. The use of Cu nanoparticles as a dispersion produced the maximum joint shear strength of 69 MPa. This shear strength value corresponded to a 15 % enhancement in joint strength compared to TLP bonds made without the use of nanoparticles dispersion.en_US
dc.description.sponsorshipThe authors would like to acknowledge The German Jordanian University (GJU), and NSERC Canada for the financial support for this research.en_US
dc.language.isoenen_US
dc.rights© Springer Science+Business Media New York 2014. The final publication is available at Springer via http://dx.doi.org/10.1007/s10853-014-8473-zen_US
dc.subjectTLP bonding, Nanoparticles, Nickel, Ti-6Al-4-V, Mg-AZ31, eutecticen_US
dc.titleApplication of Ni and Cu nanoparticles in transient liquid phase (TLP) bonding of Ti-6Al-4V and Mg-AZ31 alloysen_US
dc.status.refereedYesen_US
dc.date.Accepted2014-07-14
dc.date.application2014-07-30
dc.typeArticleen_US
dc.type.versionNo full-text in the repositoryen_US
dc.identifier.doihttps://doi.org/10.1007/s10853-014-8473-z


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