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dc.contributor.authorAtieh, A.M.*
dc.contributor.authorKhan, Tahir I.*
dc.date.accessioned2017-03-13T15:54:47Z
dc.date.available2017-03-13T15:54:47Z
dc.date.issued2014-02-21
dc.identifier.citationAtieh AM and Khan TI (2014) Transient liquid phase (TLP) brazing of Mg–AZ31 and Ti–6Al–4V using Ni and Cu sandwich foils. Science and Technology of Welding and Joining. 19(4): 333-342.en_US
dc.identifier.urihttp://hdl.handle.net/10454/11602
dc.descriptionNoen_US
dc.description.abstractTransient liquid phase (TLP) brazing of Mg–AZ31 alloy and Ti–6Al–4V alloy was performed using double Ni and Cu sandwich foils. Two configurations were tested; first, Mg–AZ31/Cu–Ni/Ti–6Al–4V and second, Mg–AZ31/Ni–Cu/Ti–6Al–4V. The effect of set-up configuration of the foils on microstructural developments, mechanical properties and mechanism of joint formation was examined. The results showed that different reaction layers formed inside the joint region depending on the configuration chosen. The formation of e phase (Mg), r (CuMg2), d (Mg2Ni) and Mg3AlNi2 was observed in both configurations. Maximum shear strength obtained was 57 MPa for Mg–AZ31/Ni–Cu/Ti–6Al–4V configuration and in both configurations, the increase in bonding time resulted in a decrease in joint strength to 13 MPa. The mechanism of joint formation includes three stages; solid state diffusion, dissolution and widening of the joint, and isothermal solidification.en_US
dc.description.sponsorshipThe authors would like to acknowledge The German Jordanian University (GJU), and NSERC Canada for the financial support for this research.en_US
dc.language.isoenen_US
dc.rights© 2014 Taylor & Francis. This is an Accepted Manuscript of an article published by Taylor & Francis Group in Science and Technology of Welding and Joining on 21/02/2014, available online: http://www.tandfonline.com/10.1179/1362171814Y.0000000196en_US
dc.subjectTransient liquid phase brazing; Electron microscopy; Ti–6Al–4V; Mg–AZ31; Ni foils; Cu foils; Shear strength; Microhardnessen_US
dc.titleTransient liquid phase (TLP) brazing of Mg–AZ31 and Ti–6Al–4V using Ni and Cu sandwich foilsen_US
dc.status.refereedYesen_US
dc.date.Accepted2014-01-26
dc.date.application2014-02-21
dc.typeArticleen_US
dc.type.versionNo full-text in the repositoryen_US
dc.identifier.doihttps://doi.org/10.1179/1362171814Y.0000000196


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