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Transient liquid phase (TLP) bonding as reaction–controlled diffusion
Atieh, A.M. Cooke, Kavian O. Epstein, M.
Atieh, A.M.
Cooke, Kavian O.
Epstein, M.
Publication Date
2022-12
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2022-08-20
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Abstract
The transient liquid phase bonding process has long been dealt with as a pure diffusion process at the joint
interface, that is, as a mass phenomenon. In spite of the advances in the application of this technique to bond
complex engineering alloys, the available models have failed to incorporate the effect of surface phenomena
on the joining process. In this work, a new reaction–controlled diffusion formulation model is proposed, and
the observation of experimental results of joining Al6061 alloy using thin single (50, 100 micron) and double
Cu foils is recorded. This work directly unveils the unique role played by surface reaction–controlled diffusion
rather than purely mass diffusion bonding process. Our experimental and modeling results reveal a conceptually
new understanding that may well explain the joint formation in TLP bonding process.
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Atieh AM, Cooke KO and Epstein M (2022) Transient liquid phase (TLP) bonding as reaction–controlled diffusion. Materials Today Communications. 33: 104293.
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